Surface Mount Technology

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Surface-mount components on circuit board
Surface-mount components on circuit board

AKA SMT



Looking at the picture on the right, the small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The visible capacitors and resistors are predominantly a combination of 0805 and 0603 package sizes, while the smallest chip capacitors are 0402 size.



Contents

[edit] Source Note

Information below was gathered from the Wikipedia Article: "Surface-mount technology"

[edit] Related Terms

SMD Dialect Expanded Form
SMD Surface Mounted Devices (active, passive and electromechanical components)
SMT Surface Mounted Technology (assembling and montage technology)
SMA Surface Mounted Assembly (module assembled with SMT)
SMD / C Surface Mounted Devices / Components (components for SMT)
SMP Surface Mounted Packages (SMD case forms)
SME Surface Mounted Equipment (SMT assembling machines)
SO Small Outline (4 to 28 pins)
VSO Very Small Outline (40 pins)
SOP Small Outline Package (case)
SOD Small Outline Diode
SOT Small Outline Transistor
SOICSmall Outline Integrated Circuit
CC Chip Carrier
LCCLeadless Chip Carrier
PLCCPlastic Leadless Chip Carrier
LCCCLeadless Ceramic Chip Carrier
MELFMetal Electrode Face Bonding
MINI MELF Mini Metal Electrode Face Bonding
MICRO MELF Micro Metal Electrode Face Bonding

[edit] Package Dimentions

Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is [JEDEC). These include:

[edit] Two-Terminal Packages.

  • Rectangular passive components (mostly resistors and capacitors):
    • 01005 (0402 metric) : 0.016" × 0.008" (0.4 mm × 0.2 mm) Typical power rating for resistors 1/32 watt
    • 0201 (0603 metric) : 0.024" × 0.012" (0.6 mm × 0.3 mm) Typical power rating for resistors 1/20 watt
    • 0204 Typical power rating for resistors 1/4 watt
    • 0402 (1005 metric) : 0.04" × 0.02" (1.0 mm × 0.5 mm) Typical power rating for resistors 1/16 watt
    • 0603 (1608 metric) : 0.063" × 0.031" (1.6 mm × 0.8 mm) Typical power rating for resistors 1/16 watt
    • 0805 (2012 metric) : 0.08" × 0.05" (2.0 mm × 1.25 mm) Typical power rating for resistors 1/10 or 1/8 watt
    • 1206 (3216 metric) : 0.126" × 0.063" (3.2 mm × 1.6 mm) Typical power rating for resistors 1/4 watt
    • 1210 (3225 metric) : 0.126" × 0.1" (3.2 mm × 2.5 mm) Typical power rating for resistors 1/2 watt
    • 1806 (4516 metric) : 0.177" × 0.063" (4.5 mm × 1.6 mm)
    • 1812 (4532 metric) : 0.18" × 0.12" (4.5 mm × 3.2 mm) Typical power rating for resistors 1/2 watt
    • 2010 (5025 metric) : 0.2" × 0.1" (5.0 mm × 2.5 mm) Typical power rating for resistors 1/2 watt
    • 2512 (6332 metric) : 0.25" × 0.12" (6.35 mm × 3.0 mm) Typical power rating for resistors 1 watt
  • Tantalum Capacitors
    • EIA 3216-12 (Kemet S, AVX S): 3.2 mm × 1.6 mm × 1.2 mm
    • EIA 3216-18 (Kemet A, AVX A): 3.2 mm × 1.6 mm × 1.8 mm
    • EIA 3528-12 (Kemet T, AVX T): 3.5 mm × 2.8 mm × 1.2 mm
    • EIA 3528-21 (Kemet B, AVX B): 3.5 mm × 2.8 mm × 2.1 mm
    • EIA 6032-15 (Kemet U, AVX W): 6.0 mm × 3.2 mm × 1.5 mm
    • EIA 6032-28 (Kemet C, AVX C): 6.0 mm × 3.2 mm × 2.8 mm
    • EIA 7260-38 (Kemet E, AVX V): 7.2 mm × 6.0 mm × 3.8 mm
    • EIA 7343-20 (Kemet V, AVX Y): 7.3 mm × 4.3 mm × 2.0 mm
    • EIA 7343-31 (Kemet D, AVX D): 7.3 mm × 4.3 mm × 3.1 mm
    • EIA 7343-43 (Kemet X, AVX E): 7.3 mm × 4.3 mm × 4.3 mm
  • SOD: Small Outline Diode
  • MELF — Metal Electrode Leadless Face — (mostly resistors and diodes): Barrel shaped components, dimensions do not match those of rectangular references for identical codes.
    • MicroMelf (MMU) Size 0102: L:2.2 mm D:1.1 mm (solder pad fits rectangular 0805) 1/5 watt (0.2 W) 100 V
    • MiniMelf (MMA) Size 0204: L:3.6 mm D:1.4 mm (solder pad fits rectangular 1206) 1/4 watt (0.25 W) 200 V
    • Melf (MMB) Size 0207: L:5.8 mm D:2.2 mm 1 watt (1.0 W) 500 V

[edit] Three Terminal Packages

[edit] Five and six terminal Packages

[edit] Packages with higher terminal count</u>

(drawings of most of the following packages can be found >HERE<)

  • Dual-in-line
    • SOIC: Small-Outline Integrated Circuit - small-outline integrated circuit, dual-in-line,
      8 or more pins, gull-wing lead form, pin spacing 1.27 mm
    • SOJ: J-Leaded Small Outline Package - the same as SOIC except J-leaded
    • TSOP: Thin Small-Outline Package, thinner than SOIC with smaller pin spacing of 0.5 mm
    • SSOP: Shrink Small-Outline Package, pin spacing of 0.635 mm or in some cases 0.8 mm
    • TSSOP: Thin Shrink Small-Outline Package.
    • QSOP: Quarter-Size Small-Outline Package, with pin spacing of 0.635 mm
    • VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
  • Quad-in-line
    • PLCC: Plastic Leaded Chip Carrier, square, J-lead, pin spacing 1.27 mm
    • QFP: Quad Flat Package, various sizes, with pins on all four sides
    • LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
    • PQFP: Plastic Quad Flat-Pack, a square with pins on all four sides, 44 or more pins
    • CQFP: Ceramic Quad Flat-Pack, similar to PQFP
    • MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
    • TQFP: Thin Quad Flat Pack, a thinner version of PQFP
    • QFN: Quad Flat Pack, no-leads, smaller footprint than leaded equivalent
    • LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder.
      Common in aviation electronics because of robustness to mechanical vibration.
    • MLP: Micro Leadframe Package, with a 0.5 mm contact pitch, no leads
    • PQFN: Power Quad Flat-Pack, no-leads, with exposed die-pad(s) for heatsinking
  • Grid arrays
    • PGA: Pin Grid Array.
    • BGA: Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
    • LGA: Land Grid Array, Same Manufacture process of BGA, has Advantage being cooler than BGA by quick Heat Deception feature. No Balls only Patch.
    • FBGA: Fine Pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface
    • LFBGA: Low Profile Fine Pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
    • TFBGA: Thin Fine Pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
    • CGA: Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
    • CCGA: Ceramic Column Grid Array, circuit packagein which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
    • μBGA: micro-BGA, with ball spacing less than 1 mm
    • LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).

[edit] Non-Packaged devices


There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.

[edit] External References

[edit] SMT Package Information

[edit] More Information on SMT

[edit] Soldering SMT Devices



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